OceanStar Signal Holdings Ltd. have been working closely with partners in Russia and Belarus on developing an advanced 3D-TSV technology that will encompass heterogenous stacking of devices, including and not limited to, analog RF, high-speed digital SoC and large size memory cells.

 

The new technology is characterized by:

- process that is scalable to high aspect ratios vias

- reducing overall form-factor by >4x

- reducing the power dissipation by >10%

when compared to conventional 2D processes.