Silicon IP System Integration 3D Packaging
  • > Silicon IP
    > Silicon IP
    > Silicon IP
    Offers a full suite of silicon provened intellectual property solutions for SoC designs, targetting for mobile phone/tablet platforms.
  • > System Integration
    > System Integration
    > System Integration

     

    End-to-end system solutions for mobile platforms and mobile network build-out. System software solutions include micro-payment transaction processing platform and Smart Grid real-time energy monitoring analytics.
  • > 3D Packaging
    > 3D Packaging
    > 3D Packaging
    3D-TSV technology "all-wet" process technology scalable to high aspect ratio vias (AR > 10), that makes possible heterogenous 3D stacking.